Organizing Committee

Academia

D. Adams, Purdue University, USA, deadams@purdue.edu

A. Emin Aktan, Drexel University, USA, aaktan@drexel.edu

C. Boller, University of Sheffield, United Kingdom, boller@sheffield.ac.uk

A. Braga, Rio Pontificia Unversidade Catolica do Rio de Janiero, abraga@mec.puc-rio.br

F. Casciati, University of Pavia, Italy, Fabio@dipmec.univpv.it

F.K. Chang (Chairman), Stanford University, USA, fkchang@stanford.edu

C. Fritzen, University of Siegen, Germany, fritzen@imr.mb.uni-siegen.de

A. Guemes (Co-Chairman), Universidad Politecnica De Madrid, Spain, aguemes@dmpa.upm.es

D. Inman, Virginia Tech, USA, dinman@vt.edu

A. Kiremidjian, Stanford University, USA, ask@stanford.edu

J. Ko, The Hong Kong Polytechnic University, cejmko@polyu.edu.hk

C. Koh, National University of Singapore, Singapore, cgkoh@nus.edu.sg

D. Thomson, University of Manitoba, Canada, thomson@ee.umanitoba.ca

A. Mita, Keio University, Japan, mita@sd.keio.ac.jp

A. Mufti, Dalhousie University, Canada, amufti@is.dal.ca

W. Ostachowicz, Polish Academy of Sciences, Poland, wieslaw@imppan.imp.gda.pl

J. Ou, Harbin Institute of Technology, China, oujinping@hit.edu.cn

U. Peil, Technical University of Braunschweig, Germany, u.peil@t-online.de

B. Spencer, University of Illinois, USA, bfs@uiuc.edu

N. Takeda, University of Tokyo, Japan, takeda@compmat.rcast.u-tokyo.ac.jp

Z. Wu, Ibaraki University, Japan, zswu@ipc.ibaraki.ac.jp

C. Yun, KAIST, Korea, ycb@kaist.ac.kr

R. Zoughi, University of Missouri-Rolla, USA, zoughi@ece.umr.edu

Industry

S. Arms, Microstrain, USA, swarms@microstrain.com

M. Buderath, EADS, Germany, Matthias.buderath@eads.com

R. Finlayson, Physical Acoustics, USA, rfinlayson@pacndt.com

P. Foote, BAE, UK, peter.foote@baesystems.com

G. Gordon, Honeywell, USA, grant.gordon@honeywell.com

E. Haugse, Boeing Company, USA, eric.d.haugse@boeing.com

S. Hyde, ATK, USA, scott.hyde@atk.com

H. Inada, Shimizu Corporation, Japan, inada@ori.shimz.co.jp

B. Jambor, Lockheed-Martin, USA, bruno.j.jambor@lmco.com

A. Kumar, Acellent Technologies, USA, akumar@acellent.com

H. Speckmann, Airbus, Germany, holger.speckmann@airbus.com

Government

G. Anderson Army Research Office, USA, Anderson@aro.arl.army.mil

D. Balageas ONERA, France, balageas@onera.fr

M. Derriso, Wright-Patterson Air Force Laboratories, USA, mark.derriso@wpafb.af.mil

C. Farrar, Los Alamos National Laboratory, USA, farrar@lanl.gov

S. Galea, DSTO Australia, Australia, steve.galea@dsto.defence.gov.au

V. Giurgiutiu, AFRL/AFOSR, USA, victor.giurgiutiu@afosr.af.mil

K. Jata, Air Force Research Laboratories, USA, kumar.jata@wpafb.af.mil

B. Lamattina, Army Research Office, USA, bruce.lamattina@us.army.mil

D. Le, Federal Aviation Administration, USA, dy.le@faa.gov

B.L. Lee, Air Force Office of Scientific Research, USA, byunglip.lee@afosr.af.mil

S. Liu, National Science Foundation, USA, sliu@nsf.gov

R. Livingston, Federal Highway Administration, USA, dick.livingston@igate.fhwa.dot.gov

P. Lloyd, Defense Research Agency, United Kingdom, palloyd@dstl.gov.uk

S. Mahmood, Naval Surface Warfare Center, USA, shah.mahmood@navy.mil

W. Prosser, NASA-Langley, USA, w.h.prosser@larc.nasa.gov

L. Richards, NASA-Dryden, USA, Richards@fox.dfrc.nasa.gov

C. Sikorsky, California Department of Transportation, USA, charles_sikorsky@dot.ca.gov

O.Venta, VTT, Finland, olli.venta@vtt.fi